聚二甲基硅氧烷复合材料中的导电网络从“沙状”转变为“石状”来增强导热性外文翻译资料

 2022-08-08 15:41:54

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A R T I C L E I N F O

Keywords:

Thermal conductivity enhancement Conductive network conversion Polymer composites

A B S T R A C T

Different from traditional compounding methods, a conversion method from “sand-like” to “stone-like” conductive network aimed at improving the thermal conductivity (TC) of polymer composites was proposed in this paper. Herein, “sand-like” and “stone-like” channels represented the thermal conductive networks (TCNs) with high and low thermal dissipation performances in polymer composites. The densification of TCNs and the adding of specific rigid particles were found to be two effective ways to realize the conductive network con- version from “sand-like” to “stone-like”. In this research, the polydimethylsiloxane/short carbon fiber/glass bubble (PDMS/SCF/GB) composite was selected to verify the practicability of this conversion theory. The SCF contents changed from 10 to 30 wt% to reveal the influence of filling content on the sand-stone conversion of TCNs. A constant content of 2 wt% GBs was selected based on our previous experience to highlight the beneficial effect of adding rigid particles. Meanwhile, the influence of product thickness on the PDMS composites was also systematically investigated. The TC of PDMS/SCF/GB composite with 0.1 mm thickness reached 11.690 W/msdot;K,

42.30 times higher than that of pure PDMS (0.27 W/msdot;K). Moreover, the superior flexibility and mechanical

property of final product provided convenience for their application as thermal management materials in electronics.

  1. Introduction

With the rapid development of microelectronics, 5G communication equipment, high-power LEDs, energy storage materials and other tech- nologies, the rapid heat accumulation in related components is un- avoidable. It will seriously affect the stability and reliability of electronic equipment [1,2]. Some research result shows that the performance of electronic equipment and components will present 10% reduction with

every 2 ◦C temperature increasement. In the field of energy storage, the

thermal conductivity (TC) of material is the key factor that affects the heat transfer ability and energy storage rate. Under this background, thermal conductive polymer composites have already become one of the key materials in many important engineering fields.

Polymer materials have excellent properties such as light weight, high flexibility, good chemical corrosion resistance, and convenient processing, which can meet the requirements in many applications. However, the thermal conductivities of most polymer materials were relatively poor (0.1–0.5 W/msdot;K) and couldnrsquo;t meet the requirements of efficient heat conduction/dissipation capacity in the application

situations mentioned above [3–5]. Therefore, there exits great theoret- ical and practical significance to explore the methods for thermal con- ductivity enhancement of polymer materials. At present, the research in this field has encountered a big bottleneck. Although the significant enhancement of thermal conductivity by orders of magnitude is theo- retically feasible, the actual enhancement results are often not satis- factory. The introduce of new ideas and new methods for thermal conductivity enhancement are highly essential to achieve greater breakthroughs.

The synthesis of intrinsic thermal conductive polymer materials and the fabrication of thermal conductive polymer composites are two main approaches to obtain polymer-based material with high thermal con- ductivity. Compared with the low fabrication efficiency, cumbersome synthesis process, and high cost for the synthesis of intrinsic thermal conductive polymer materials, the fabrication of the latter shows the advantages of easy operation, low cost, suitable for industrial produc- tion, and has already become the mainstream development direction of thermal conductive polymer materials [6–9]. Till now, it is a common method to enhance the thermal conductivity of polymer composites by

* Corresponding author.

E-mail address: sunjingyao@mail.buct.edu.cn (J. Sun).

https://doi.org/10.1016/j.coco.2020.100509

Received 12 August 2020; Received in revi

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